Redmi is bringing a powerful phone with 3D ice cooling technology

Wang Teng claims that the Redmi K70 Ultra ranks first in the Android segment in terms of performance. According to the official poster, the phone achieved an Untutu score of 23,82,780 points. Apart from this, he also claimed that the actual gaming performance of the phone will be "much better than expected".

Redmi has reportedly teamed up with MediaTek to make the most of the chipset in their new phone, which will house the "powerful" Dimension 9300 Plus processor. However, the device needs to be tested before any decision can be made about its performance.

Redmi's general manager also revealed that the Redmi K70 Ultra will come with a new generation of 3D ice cooling technology, which uses an innovative concave-convex platform design. The convex side is closer to the processor, which reduces the core temperature in the processor by up to 3 degrees compared to the Redmi K60 Ultra. Usually the screen also gets warm when the phone is doing heavy work. There is also a solution for this in upcoming devices. The concave side of the heatsink is far from the screen, which will result in lower screen temperatures.

Coupled with the new cooling system is the MediaTek Dimension 9300 Plus chipset, which will allow the phone to offer gameplay at 120 fps for Genshin Impact and is capable of handling two games at the same time. Along with these, the phone is claimed to offer the strongest gaming performance compared to its competitors.

It is already known that the Redmi K70 Ultra phone will offer a D1 independent graphics chip for better performance and optimal use of resources. It will offer a 1.5K display with a 144Hz refresh rate and will be backed by a 5,500mAh battery, which will support 120W fast charging. Besides, the phone will feature a metal middle frame and glass back cover. The camera module will come with a slightly different design.